Fabrication process description
Regarding the LOCīs microfabrication process, vast research has been carried out so far. The first chips were made out of silicon by microfabrication process inheritated from the microelectronic industry. Subsequently, many interesting advances were developed using replication of micro plastic parts by Hot Embossing, Injection Moulding and by Lamination. These techniques radically reduced the LOC price making the device disposable. Nevertheless, these technologies do not allow the integration of other components, such as sensors or actuators (i.e. heaters, electrodes) requiring a fixed and complex bulky reader.
Recently, an interest has grown up among LOC research community on negative photoresist spun on glass (e.g. SU8). Actually, partners of this proposal created (DTU-MIC - DTU-VET) and consolidated this trend (IKERLAN - GAIKER).
Consequently, a polymer would be an excellent candidate due to the intrinsic capability of being modified by diluting or mixing with other substances. This type of material has always been used as a high aspect ratio mask in etching processes and then stripped away. Therefore, there is an extensive list of recipes to obtain deep, vertical and narrow structures that can be easily combined with any microfabricated structure or biosensor
The right balance between relevant, feasible and efficient research.
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